Camera module and optical device including same

ABSTRACT

An embodiment comprises a lens driving part including a lens, a connection substrate connected to the lens driving part, and a connector part connected to the connection substrate. The connector part comprises a substrate including, on the upper surface thereof, a cavity and a ground layer, a noise shield part located within the cavity of the substrate and contacting the ground layer, and a reinforcement member located on the noise shield part. The reinforcement member is located in the cavity of the substrate and on the upper surface of the substrate. In a top view, the length of one side of the noise shield part is less than the length of one side of the cavity of the substrate.

TECHNICAL FIELD

Embodiments relate to a camera module and an optical device includingthe same.

BACKGROUND ART

It is difficult to apply technology of a voice coil motor (VCM) used inexisting general camera modules to a subminiature, low-power cameramodule, and therefore research related thereto has been activelyconducted.

Demand for and production of electronic products, such as smartphonesand mobile phones equipped with cameras, have increased. Cameras formobile phones are trending toward increased resolution andminiaturization. As a result, an actuator has also been miniaturized,increased in diameter, and been made multifunctional. In order torealize a high-resolution camera for mobile phones, improvement in theperformance of the camera for mobile phones and additional functionsthereof, such as autofocusing, handshake correction, and zooming, arerequired.

DISCLOSURE Technical Problem

Embodiments provide a camera module and an optical device including thesame, which are capable of improving performance of blocking EMI noiseand of reducing the electrical resistance between the reinforcing memberand the ground of the board.

Technical Solution

A camera module according to an embodiment includes a lens moving unitincluding a lens, a connecting board connected to the lens moving unit,and a connector unit connected to the connecting board, wherein theconnector unit includes a board including a cavity and a ground layerformed in an upper surface thereof, a noise-blocking unit disposed inthe cavity in the board so as to be in contact with the ground layer,and a reinforcing member, which is disposed on the noise-blocking unitand is disposed over the cavity in the board and on an upper surface ofthe board, and wherein a length of one side of the noise-blocking unitis less than a length of one side of the cavity in the board when viewedin a plan view.

The noise-blocking unit includes a first portion disposed in the cavityin the board and a second portion disposed on the connecting board, anend of the first portion being disposed in the cavity in the board.

A length of a short side of the noise-blocking unit may be less than alength of a long side of the cavity in the board.

A region of the ground layer may define a bottom surface of the cavityin the board.

A length of one long side of the cavity in the board may be greater thana length of another long side of the cavity in the board.

The camera module may further include an adhesive disposed between thereinforcing member and the noise-blocking unit.

The cavity in the board may include a first inner surface, and thenoise-blocking unit may include a first surface that faces the firstinner surface of the cavity in the board, the first surface of thenoise-blocking unit being spaced apart from the first inner surface ofthe cavity in the board.

The cavity in the board may include a second inner surface that facesthe first inner surface and a third inner surface connecting the firstinner surface to the second inner surface, and the noise-blocking unitmay include a second surface that faces the second inner surface of thecavity in the board and a third surface that faces the third innersurface of the cavity in the board, the second surface of thenoise-blocking unit being spaced apart from the second inner surface ofthe cavity in the board, and the third surface of the noise-blockingunit being spaced apart from the third inner surface of the cavity inthe board.

A portion of the adhesive may be disposed in the cavity in the board.

A vertical length of the noise-blocking unit and a vertical length ofthe adhesive may be less than a vertical length of the cavity, thevertical direction being a direction that is perpendicular to an opticalaxis of the lens moving unit and extends from a first outer surface to asecond outer surface of a second region of the board, and the first andsecond outer surfaces of the second region facing each other.

The adhesive may include a conductive particle, which is in contact withthe ground layer through the noise-blocking unit.

A resistance value between the reinforcing member and the ground layermay be lower than 1 ohm.

A camera module according to another embodiment includes a lens movingunit including a lens, a connecting board connected to the lens movingunit, and a connector unit connected to the connecting board, whereinthe connector unit includes a board including a cavity and a groundlayer formed in an upper surface thereof, a noise-blocking unit disposedin the cavity in the board so as to be in contact with the ground layer,and a reinforcing member, which is disposed on the noise-blocking unitand is disposed over the cavity in the board and on an upper surface ofthe board, wherein the noise-blocking unit includes a first portiondisposed in the cavity in the board and a second portion disposed on theconnecting board, and the end of the first portion is disposed in thecavity in the board.

Advantageous Effects

Embodiments are able to improve the performance of blocking EMI noiseand to reduce the electrical resistance between the reinforcing memberand the ground of the board.

DESCRIPTION OF DRAWINGS

FIG. 1 is a cross-sectional view of the camera module according to anembodiment;

FIGS. 2A to 2D are views illustrating a procedure of coupling anoise-blocking unit, an adhesive and a reinforcing member to a board;

FIG. 3 is a cross-sectional view taken along line A-B in FIG. 2D;

FIG. 4 is a cross-sectional view taken along line C-D in FIG. 2D;

FIG. 5 is a cross-sectional view of an embodiment of the board shown inFIG. 1;

FIG. 6 is a view illustrating an embodiment of the adhesive;

FIG. 7 is a view illustrating the case in which the size of an adhesiveand the size of an EMI film are larger than the size of a groove in aboard;

FIG. 8 is a perspective view of a camera module according to anotherembodiment;

FIG. 9 is a perspective view of a portable terminal according to anembodiment; and

FIG. 10 is a view illustrating the configuration of the portableterminal illustrated in FIG. 9.

BEST MODE

Hereinafter, embodiments will be clearly elucidated via descriptionthereof with reference to the accompanying drawings. In the followingdescription of the embodiments, it will be understood that, when anelement such as a layer (film), region, pattern, or structure isreferred to as being “on” or “under” another element, it can be“directly” on or under the other element, or can be “indirectly”disposed such that an intervening element may also be present. Inaddition, it will also be understood that the criteria for “on” or“under” are determined on the basis of the drawings.

In the drawings, the dimensions of layers may be exaggerated, omitted orillustrated schematically for clarity and convenience of description. Inaddition, the dimensions of constituent elements may not accuratelyreflect the actual dimensions thereof. Wherever possible, the samereference numbers will be used throughout the drawings to refer to thesame or like parts.

Hereinafter, a camera module according to an embodiment will bedescribed with reference to the accompanying drawings. For theconvenience of description, although the camera module according to theembodiment is described using a rectangular coordinate system (x, y, z),the lens moving unit may be described using some other coordinatesystems, and the embodiments are not limited with regard thereto. In therespective drawings, the X-axis direction and the Y-axis direction meandirections perpendicular to an optical axis, i.e. the Z-axis. The Z-axisdirection, which is the optical-axis direction, may be referred to as a“first direction”, the X-axis direction may be referred to as a “seconddirection”, and the Y-axis direction may be referred to as a “thirddirection”.

The camera module according to the embodiment of the present inventionis capable of performing an “auto-focusing function”. Here, the“auto-focusing function” serves to automatically focus an image of asubject on an image sensor surface.

In addition, the camera module according to the embodiment may perform afunction of “handshake correction”. Here, the function of “handshakecorrection” may serve to prevent the contour line of a captured imagefrom being indistinctly formed due to vibration caused by shaking of theuser's hand when capturing a still image.

FIG. 1 is a cross-sectional view of the camera module 200 according tothe embodiment.

Referring to FIG. 1, the camera module 200 may include a board 800, aholder 600 disposed on the board 800, a lens moving unit 100 mounted onthe holder 600, a connector 840 disposed on the board 800, anoise-blocking unit 70, a reinforcing member 85 disposed on the board800, and an adhesive 83 interposed between the reinforcing member 85 andthe board 800.

The board 800 may include a plurality of pattern layers, an insulationlayer interposed between the plurality of pattern layers, cover layersdisposed on the outermost pattern layers, among the plurality of patternlayers, so as to protect the pattern layers, and a contact (or a via)adapted to conductively connect the pattern layers to each other.

The board 800 may include a first region 801 in which the lens movingunit 100 is disposed, a second region 802 in which the connector 840 isdisposed, and a third region 803 connecting the first region 801 to thesecond region 802.

The first region 801 of the board 800 may alternatively be referred toas a “first board”, the second region 802 of the board may alternativelybe referred to as a “second board”, and the third region 803 of theboard 800 may alternatively be referred to as a “connecting board”.

In another embodiment, the first region 801 or the first board of theboard 800 may be included in the lens moving unit 100.

Each of the first region 801 and the second region 802 of the board 800may include a flexible substrate 800-1 and rigid substrates 800-2 and800-3. The reason for this is because each of the first region 801 andthe second region 802 requires a predetermined strength in order to becapable of supporting the lens moving unit 100 and the connector 840.

For example, each of the first region 801 and the second region 802 ofthe board 800 may include a first rigid substrate 800-2, disposed on theflexible substrate 800-1, and a second rigid substrate 800-3, disposedbeneath the flexible substrate 800-1.

The third region 802 of the board 800 may include the flexible substrate800-1. The flexible substrate 800-1 included in the first to thirdregions 801 to 803 of the board 800 may be integrally formed.

Although each of the first region 801 and the second region 802 may be arigid substrate and the third region may be a flexible substrate, asdescribed above, the disclosure is not limited thereto. In anotherembodiment, at least one of the first to third regions 801 to 803 of theboard 800 may include a rigid substrate, and the remaining ones of thefirst to third regions 801 to 803 may include a flexible substrate.

FIG. 5 is a cross-sectional view of an embodiment of the board 800 shownin FIG. 1.

Referring to FIG. 5, the board 800 may include a plurality of patternlayers 82-1 to 82-6, which are disposed so as to be spaced apart fromeach other in the optical-axis direction or in the vertical direction,insulation layers (or insulation barriers or insulation films) 91-1 to91-5 interposed between the plurality of pattern layers 82-1 to 82-6 soas to insulate the pattern layers from each other, and cover layers 81a, 81 b, 92-1 and 92-2 for protecting the plurality of pattern layers82-1 to 82-6 from external impact or the like.

Referring to FIG. 5, the flexible substrate 800-1 may include aninsulation layer 91-3, a pattern layer 82-3 disposed on the insulationlayer 91-3, and a pattern layer 82-4 disposed beneath the insulationlayer 91-3.

The first rigid substrate 800-2 may include pattern layers 82-1 and 82-2disposed on the flexible substrate 800-1 (for example, the pattern layer82-3), an insulation layer 91-1 interposed between the pattern layers82-1 and 82-2, and an insulation layer 91-2 interposed between theflexible substrate 800-1 (for example, the pattern layer 82-3) and thefirst rigid substrate 800-2 (for example, the pattern layer 82-2).

The second rigid substrate 800-3 may include pattern layers 82-5 and82-6 disposed beneath the flexible substrate 800-1 (for example, thepattern layer 82-4), an insulation layer 91-4 interposed between theflexible substrate 800-1 (for example, the pattern layer 82-4), and aninsulation layer 91-5 interposed between the pattern layers 82-5 and82-6.

The insulation layer 91-3 of the board 800 may be a flexible insulationlayer, for example, a polyimide layer capable of being flexibly bent.

Each of the insulation layers 91-1, 91-2, 91-4 and 91-5 of the board 800may be a rigid insulation or a prepreg layer, which has a greaterstrength or hardness than the flexible insulation layer.

For example, each of the pattern layers 82-1 to 82-6 may alternativelybe referred to as a copper foil, a conductive layer or a conductivepattern, and each of the insulation layers 91-1 to 91-5 mayalternatively be referred to as an insulation barrier or an insulationfilm.

Referring to FIG. 5, although the number of pattern layers of theflexible substrate 800-1 is two and the number of pattern layers of eachof the first and second rigid substrates 800-2 and 800-3 is two, thedisclosure is not limited thereto. In another embodiment, the number ofpattern layers of the flexible substrate 800-1 and the number of patternlayers of each of the first and second rigid substrates 800-2 and 800-3may be one or more.

The cover layers of the board 800 may include a cover layer 81 adisposed on the pattern layer 82-1 of the first rigid substrate 800-2, acover layer 81 b disposed on the pattern layer 82-6 of the second rigidsubstrate 800-3, a cover layer 92-1 disposed on the pattern layer 82-3of the flexible substrate 800-1 of the third region 803, and a coverlayer 92-2 disposed beneath the pattern layer 82-4 of the flexiblesubstrate 800-1 of the third region 803. Each of the cover layers of theboard 800 may be made of an insulation material, for example, a solderresist material.

Furthermore, the board 800 may include a via adapted to conductivelyconnect two pattern layers to each other, among the pattern layers 82-1to 82-6 of the flexible substrate 800-1 and the first and second rigidsubstrates 800-2 and 800-3. Here, the via may alternatively be referredto as a contact or a contact via.

For example, the board 800 may include at least one via 93-4, adapted toconductively connect the pattern layers 82-1 to 82-6 of the flexiblesubstrate 800-1 to each other, and at least one via 93-1 to 93-4,adapted to conductively connect two of the pattern layers 82-1 to 82-6of the first and second rigid substrates 800-2 and 800-3 to each other.

A cavity 31 in the board 800 may expose the pattern layer 82-6 of theboard 800 from a second surface 11 b of the second region 802 of theboard 800. Here, the cavity 31 may alternatively be referred to as arecess.

The pattern layer 82-6 may include a “ground layer”, or mayalternatively be referred to as a “ground layer” or an “earth layer”.

The portion of the ground layer 82-6 that is exposed through the cavity31 may form the bottom surface of the cavity 31 in the second board 802.

The holder 600 may be disposed on the first region 801, and the lensmoving unit 100 may be disposed or mounted on the holder 600 disposed onthe board 800.

The connector 840 may be disposed on the second region (or the “secondboard”) 802 of the board 800. For example, the connector 840 may bedisposed on one surface of the second region 802 of the board 800. Thecavity 31 may be formed in the outer surface of the second region 802 ofthe board 800, and may expose the ground layer from the other surface ofthe second region 802.

The connector 840, the second region (or the second board) 802 of theboard 800, at least a portion of the noise-blocking unit 70 and thereinforcing member 85 may together constitute a “connector” unit.

For example, the holder 600 and the lens moving unit 100 may be disposedon the first surface 11 a of the first region 801 of the board 800, andthe connector 840 may be disposed on the first surface 11 a of thesecond region 802 thereof.

The terminals of the lens moving unit 100 may be conductively connectedto at least one of the pattern layers (for example, 82-1 to 82-6) of thefirst region 801 of the board 800, and the terminals of the connector840 may be conductively connected to at least one of the pattern layers82-1 to 82-6 of the second region 802 of the board 800.

For example, the terminals of the lens moving unit 100 may beconductively connected to the pattern layers 82-3 and 82-4 of theflexible substrate 800-1 of the first region 801, and the terminals ofthe connector 840 may be conductively connected to the pattern layers82-3 and 82-4 of the flexible substrate 800-1 of the second region 802of the board 800. The terminals of the lens moving unit 100 may beconductively connected to the terminals of the connector 840 via theflexible substrate 800-1.

The noise-blocking unit 70 may be disposed beneath the second region 802of the board 800.

Furthermore, the noise-blocking unit 70 may be disposed at both upperand lower portions of the flexible substrate 800-1 of the third region803 of the board 800. The noise-blocking unit 70 may alternatively bereferred to as a noise-blocking layer, an “EMI (Electro MagneticInterference)-blocking unit”, an EMI-shielding unit, an EMI film or anEMI tape.

The noise-blocking unit 70 may include a first noise-blocking portion 71and a second noise-blocking portion 72.

The first noise-blocking portion 71 may be disposed beneath the secondregion 802 and the third region 803 of the board 800. For example, thefirst noise-blocking portion may include a first portion (or a firstregion) 71 a, which is disposed in the cavity 31 in the second region802 of the board 800, and a second portion (or a second region) 71 b,which is disposed beneath the flexible substrate 800-1 of the thirdregion 803 of the board 800.

The second noise-blocking portion 72 may be disposed on the third region803 of the board 800.

The noise-blocking unit 70 may further include a portion that isdisposed on the upper surface and/or the lower surface of the firstregion 803 of the board 800.

The second portion 71 b of the first noise-blocking portion 71 may bedisposed or formed only on a portion of the third region (or theconnecting board) 803.

The first noise-blocking portion 71 may further include a third portion71 c, which is disposed between the first portion 71 a and the secondportion 71 b so as to connect the first portion 71 a to the secondportion 71 b.

For example, the third portion 71 c may be disposed on the lower surface(or the cover layer 81 b) of the second region 802 of the board 800,which connects a fourth inner surface 31 d of the cavity 31 to a fourthouter surface 5 d of the second region 802 of the board 800.

The reinforcing member 85 may be disposed beneath the second region (orthe “second board”) 802 of the board 800.

For example, the reinforcing member 85 may be disposed beneath the firstportion 71 a of the first noise-blocking portion 71, which is disposedbeneath the second region 802 of the board 800.

For example, the reinforcing member 85 may be disposed above the cavity31 in the second board 802 and on the upper surface of the second board802.

The reinforcing member 85 may be made of conductive material having highthermal conductivity, for example, metal. Although the reinforcingmember 85 may be made of, for example, stainless steel, aluminum or thelike, the disclosure is not limited thereto.

The reinforcing member 85 may be conductively connected to the groundterminal of the board 300 so as to serve as a ground for protecting thecamera module from electrostatic discharge (ESD).

The adhesive 83 may be disposed between the reinforcing member 85 andthe first noise-blocking portion 71.

For example, the adhesive 83 may be disposed between the first portion71 a of the first noise-blocking portion 71 and the reinforcing member85 so as to fix or attach the reinforcing member 85 to the second region802 of the board 800.

Referring to FIG. 3, although the upper surface of the reinforcingmember 85 may be spaced apart from the lower surface of the second board802 (for example, the lower surface of the cover layer 81 b), thedisclosure is not limited thereto. In another embodiment, the uppersurface of the reinforcing member 85 may be in contact with the lowersurface of the second board 802 (for example, the lower surface of thecover layer 81 b).

A portion of the adhesive 83 may be disposed in the cavity 31 in thesecond board.

The second region (or the second board) 802 of the board 800 accordingto the embodiment may have therein the cavity 31 having an inlet throughwhich a portion of the pattern layer (for example, 82-6, see FIG. 5) isexposed.

Here, the region of the pattern layer 82-6 that is exposed through thecavity 31 may serve as a ground layer for grounding the board 800, ormay be conductively connected to the ground of the board 800.

The region of the pattern layer 82-6 that is exposed through the cavity31 may be conductively connected to the ground pin or the terminal ofthe connector 840.

For example, the cavity 31 may be formed by cutting away a portion ofthe cover layer 81 b of the second region 802 of the board 800, and thelower surface of a portion of the pattern layer (for example, 82-6, seeFIG. 5) of the second region 802 may be exposed through the cavity 31.

The first noise-blocking portion 71 may be disposed in the cavity 31 inthe second region 802 of the board 800. At least a portion of theperiphery of the first noise-blocking portion 71 may be disposed in thecavity 31.

For example, the first portion 71 a of the first noise-blocking portion71 may be disposed in the cavity 31 in the second region 802 of theboard 800.

The adhesive 83 may be disposed on the first noise-blocking portion 71disposed in the cavity 31, and the reinforcing member 85 may be disposedon the adhesive 83.

By disposing the first portion 71 a of the first noise-blocking portion71 in the cavity 31 in the second region 802 of the board 800 and thendisposing the adhesive 83 on the first portion 71 a of the firstnoise-blocking portion 71 disposed in the cavity 31, the embodiment isable to block or reduce the noise generated by the camera module and toreduce the resistance between the reinforcing member 85 and the board800 (for example, the ground (GND)).

FIGS. 2A to 2D illustrate a procedure of coupling the noise-blockingunit 71, the adhesive 83 and the reinforcing member 85 to the board 800.FIG. 3 is a cross-sectional view taken along line A-B in FIG. 2D. FIG. 4is a cross-sectional view taken along line C-D in FIG. 2D.

FIGS. 2A to 2D are bottom views illustrating the second region 802 andthe third region 803 of the board 800. FIGS. 3 and 4 are cross-sectionalviews illustrating states in which FIG. 2D is rotated to 180 degrees.

Referring to FIG. 2A, the cavity 31 is formed in the second surface ofthe second region 802 of the board 800 so as to expose the pattern layer(or the ground layer) 82-6 from the second surface. The exposed groundlayer is not limited to the shape shown in FIG. 2A (for example, an ‘L’shape), and may have any of various polygonal shapes (for example, arectangular shape, a triangular shape or the like) or a circular shape.

Referring to FIG. 2A, the left and lower end of the pattern layer 82-6may not be exposed through the cavity 31. The left and lower end of thepattern layer 82-6 may be provided with a ground layer (for example, a“first ground layer” or a “digital ground layer”), which is exposedthrough the cavity 31, and another ground layer (for example, a “secondground layer” or an “analog ground layer”), which is separated or spacedapart from the first ground layer.

In another embodiment, the second ground layer may also be exposedthrough the cavity 31, and the first noise-blocking portion 71 and theadhesive 83 may be disposed between the exposed ground layer and thereinforcing member 85.

For example, the cavity 31 may be formed so as to expose the lowersurface of the pattern layer 82-6 by removing a portion of the coverlayer 81 b of the second region 802 of the board 800.

The second region 802 of the board 800 may have four outer surfaces 5 ato 5 d.

For example, the plan view of the second region 802 of the board 800 mayhave a rectangular shape having four sides 5 a to 5 d.

Each of the distances d1 and d2 between the outer surfaces (or sides) 5a to 5 d of the second region 802 and the cavity 31 may range from 0.3mm to 0.5 mm.

The depth H of the cavity 31 may be equal to the thickness of the coverlayer 81 b of the board 800. For example, the depth H of the cavity 31may be the length of the lens or the lens barrel 400 of the lens movingunit 100. For example, the depth H may range from 21 m to 24 m. Forexample, the depth H may be 23 m.

Referring to FIG. 2B, the portion 71 a of the first noise-blockingportion 71 is disposed in the cavity 31 in the second region 802 of theboard 800.

The first noise-blocking portion 71 may include the first portion 71 adisposed in the cavity 31 in the second region 802 of the board 800 andthe second portion 71 b disposed beneath the third region 803 of theboard 800. Furthermore, the first noise-blocking portion 71 may includethe third portion connecting the first portion to the second portion.

For example, the second portion 71 b of the first noise-blocking portion71 may be disposed on the connecting board 803, and the end of the firstportion 71 a may be disposed in the cavity 31 in the second board 802.For example, a portion of the end of the first portion 71 a may bedisposed in the cavity 31.

The first portion 71 a of the first noise-blocking portion 71 may bedisposed beneath the pattern layer 82-6 of the second region 802 of theboard 800 that is exposed through the cavity 31.

The cavity 31 in the board 800 may include the inner surfaces 31 a to 31d and the bottom surface. Here, the inner surface of the cavity 31 mayalternatively be referred to as a “side wall”, a “side surface” or an“inner wall”.

For example, the first inner surface 31 a and the second inner surface31 b may face each other, and the third inner surface 31 c and thefourth side surface 31 d may face each other. The third inner surface 31c may connect one end of the first inner surface 31 a to one end of thesecond inner surface 31 b, and the fourth inner surface 31 d may connectthe other end of the first inner surface 31 a to the other end of thesecond inner surface 31 b.

The bottom surface of the cavity 31 may be one surface (for example, thelower surface) of the pattern layer 82-6 of the second region 802 of theboard 800 that is exposed. The lower surface of the first portion 71 aof the first noise-blocking portion 71 may be in contact with the bottomsurface of the cavity 31.

For example, the first portion 71 a of the first noise-blocking portion71 may include a first surface 21 a (or a “first side surface”) thatfaces the first inner surface 31 a of the cavity 31, a second surface 21b (or a “second side surface”) that faces the second inner surface 31 bof the cavity 31, and a third surface 21 c (or a “third side surface”)that faces the third inner side surface 31 c of the cavity 31.

The side surface of the first portion 71 a of the first noise-blockingportion 71 may be positioned in the cavity 31 in the second region 802of the board 800, and may be spaced apart from the second surface 11 bof the second region 802 of the board 800.

For example, the first surface 21 a, the second surface 21 b and thethird surface 21 c of the first portion 71 a of the first noise-blockingportion 71 may be positioned in the cavity 31 in the second region 802,and may be spaced apart from the second surface 11 b of the secondregion 802 of the board 800.

The vertical length of the second portion 71 b of the firstnoise-blocking portion 71 may be greater than the vertical length L3 ofthe first portion 71 a. The reason for this is to improve the effect ofblocking EMI in the third region 803 of the board 800.

The length (or width) L3 of one side of the first noise-blocking portion71 may be less than the length (or width) L1 of one side of the cavity31 in the second board 802.

For example, the length of a first long side that is positioned at oneside of the cavity 31 of the second board 802 may be greater than thelength of a second long side that is positioned at the other side of thecavity 31. For example, the first long side and the second long side mayface each other.

For example, the length of a first short side that is positioned at oneside of the cavity 31 in the second board 802 may be greater than thelength of a second short side that is positioned at the other side ofthe cavity 31. For example, the first short side and the second shortside may face each other.

For example, the length L3 of a short side of the first noise-blockingportion 71 may be less than the length L1 of a long side of the cavity31 in the second board 802.

The vertical length L3 of the first portion 71 a of the firstnoise-blocking portion 71 may be less than the vertical length L1 of thecavity 31 in the board 800 (L3<L1).

The horizontal length L4 of the first portion 71 a of the firstnoise-blocking portion 71 may be less than the horizontal length L2 ofthe cavity 31 in the board 800 (L4<L2).

For example, the vertical direction may be the direction of Line A-B inFIG. 2D or the y-axis direction in FIG. 1, which is perpendicular to theoptical-axis direction of the lens moving unit 100.

Alternatively, the vertical direction may be a direction that isperpendicular to the optical-axis direction of the lens moving unit 100(or the axis of the image sensor 8100) and extends from the first outersurface 5 a to the second outer surface 5 b of the second region 802 ofthe board 800.

Alternatively, the vertical direction may be a direction perpendicularto a direction that extends from the image sensor 810 to the connector840.

For example, the horizontal direction may be the direction of line C-Din FIG. 2D or the x-axis direction in FIG. 1, which is perpendicular tothe optical-axis direction of the lens moving unit 100.

For example, the vertical direction may be a direction that extends fromthe first inner surface 31 a to the second inner surface 31 b of thecavity 31 in the board 800, and the horizontal direction may be adirection that extends from the third inner surface 31 c to the fourthinner surface 31 d of the cavity 31 of the board 800.

For example, the area of the lower surface (or the upper surface) of thefirst portion 71 a of the first noise-blocking portion 71 disposed inthe cavity 31 in the board 800 may be smaller the area of the bottomsurface of the cavity 31 in the board 800 (or the area of the exposedlower surface of the pattern layer 82-6).

The distance d3 between the first surface 21 a of the first portion 71 aof the first noise-blocking portion 71 and the first outer surface 5 aof the second region 802 of the board 800 or the distance d3 between thesecond surface 21 b of the first portion 71 a of the firstnoise-blocking portion 71 and the second outer surface 5 b of the secondregion 802 of the board 800 may be greater than the distance d1 (d3>d1).

The distance d4 between the third surface 21 c of the first portion 71 aof the first noise-blocking portion 71 and the third outer surface 5 cof the second region 802 of the board 800 may be greater than thedistance d2 (d4>d2).

Because the distance d3 is greater than the distance d1 (d3>d1) and thedistance d4 is greater than the distance d2 (d4>d2), the first portion71 a of the first noise-blocking portion 71 may be disposed in thecavity 31.

In FIG. 2B, the distance d4 may be greater than the distance d3 (d4>d3).For example, the distance d3 may range from 0.6 mm to 0.8 mm, and thedistance d4 may range from 0.9 mm to 1.1 mm. In another embodiment, thedistance d4 may be equal to the distance d3 (d4=d3) or may be less thanthe distance d3 (d4<d3).

Referring to FIG. 3, the first to third surfaces 21 a to 21 c of thefirst portion 71 a of the first noise-blocking portion 71 may be spacedapart from the first to third inner surfaces 31 a to 31 c of the cavity31 in the board 800.

For example, the first surface 21 a may be spaced apart from the firstinner surface 31 a of the cavity 31, the second surface 21 b may bespaced apart from the second inner surface 31 b of the cavity 31, andthe third surface 21 c may be spaced apart from the third inner surface31 c of the cavity 31.

The distance between the third surface 21 c of the first noise-blockingportion 71 and the third surface 31 c of the cavity 31 may be differentfrom the distance between the first surface 21 a of the firstnoise-blocking portion 71 and the first inner surface 31 a of the cavity31 and/or the distance between the second surface 21 b of the firstnoise-blocking portion 71 and the second inner surface 31 b of thecavity 31.

For example, the distance between the third surface 21 c of the firstnoise-blocking portion 71 and the third surface 31 c of the cavity 31may be greater than the distance between the first surface 21 a and thefirst inner surface 31 a of the cavity 31 and/or the distance betweenthe second surface 21 b and the second inner surface 31 b of the cavity31.

For example, the distance between the inner surfaces 31 a to 31 d of thecavity 31 and the end surfaces (for example, 21 a to 21 c) of the firstnoise-blocking portion 71 may be greater than the distance between theinner surfaces 31 a to 31 d of the cavity 31 and the end surfaces of theadhesive 83. The reason for this is to increase the surface area of theadhesive 83 and thus to increase the adhesive force between thereinforcing member 85 and the second board 802.

For example, although the horizontal (or vertical) distance between theinner surfaces 31 a to 31 d of the cavity 31 and the end surfaces of thereinforcing member 85 may be greater than the horizontal (or vertical)distance between the inner surfaces 31 a to 31 d of the cavity 31 andthe end surfaces (for example, 21 a to 21 c) of the first noise-blockingportion 71, the disclosure is not limited thereto. In anotherembodiment, the former may be equal to or less than the latter.

For example, although the horizontal (or vertical) distance between theinner surfaces 31 a to 31 d of the cavity 31 and the end surfaces of thereinforcing member 85 may be greater than the horizontal (or vertical)distance between the inner surfaces 31 a to 31 d of the cavity 31 andthe end surfaces of the adhesive 83, the disclosure is not limitedthereto. In another embodiment, the former may be equal to or less thanthe latter.

Referring to FIGS. 2c and 2d , the reinforcing member 85 is attached tothe first portion 71 a of the first noise-blocking portion 71 disposedin the cavity 31 via the adhesive 83.

For example, the reinforcing member 65 may be fixed or attached to thefirst portion 71 a of the first noise-blocking portion 71 in such a wayas to apply or form the adhesive 83 to one surface (for example, theupper surface) of the reinforcing member 85 and then to press thereinforcing member 85 having thereon the adhesive 83 to the firstportion 71 a of the first noise-blocking portion 71 using a hot press.By virtue of the pressing operation, the upper surface of thereinforcing member 85 may come into contact with the second surface (orthe lower surface) 11 b of the second region 802 of the board 800.

The adhesive 83 may be conductive adhesive, or may include conductiveadhesive (for example, conductive particles). For example, the adhesive83 may be FGBF-700.

The side surface of the adhesive 83 may be spaced apart from the secondsurface 11 b of the second region 802 of the board 800.

The vertical length L5 of the adhesive 83 may be less than the verticallength L1 of the cavity 31 in the board 800 (L5<L1). The horizontallength L6 of the adhesive 83 may be less than the horizontal length L2of the cavity 31 in the board 800 (L6<L2).

The vertical length L5 of the adhesive 83 may be greater than or equalto the vertical length L3 of the first portion 71 a of the firstnoise-blocking portion 71.

The horizontal length L6 of the adhesive 83 may greater than or equal tothe horizontal length L4 of the first portion 71 a of the firstnoise-blocking portion 71.

The distance d5 between the first side surface of the adhesive 83 andthe first outer surface 5 a of the second region 802 of the board 800 orthe distance d5 between the second side surface of the adhesive 83 andthe second outer surface 5 b of the second region 802 of the board 800may be greater than the distance d1 (d5>d1). In another embodiment, thedistance d5 may be equal to the distance d1 (d5=d1).

The distance d6 between the third side surface of the adhesive 83 andthe third outer surface 5 c of the second region 802 of the board 800may be greater than the distance d2 (d6>d2). In another embodiment, thedistance d6 may be equal to the distance d2 (d6=d2).

For example, each of the distance d5 and the distance d6 may range from0.5 mm to 0.6 mm.

d1:d3 may range from 1:1.2 to 1:2.65, and d2:d4 may range from 1:1.8 to1:3.65.

d1:d5 may range from 1:1 to 1:2, and d2:d6 may range from 1:1 to 1:2.

If d3/d1 is less than 1.2, because the difference between the horizontallength of the first portion 71 a of the first noise-blocking portion 71and the horizontal length of the cavity 31 is very small, a processmargin required to dispose the first portion 71 a of the firstnoise-blocking portion 71 is insufficient, and the first noise-blockingportion 71 may escape outwards from the cavity 31, with the result thatthe resistance value between the reinforcing member 85 and the ground ofthe board 800 may increase to 1 ohm or higher.

If d3/d1 is greater than 2.65, the surface area of the first portion 71a of the first noise-blocking portion 71 may decrease, and thus theability to block noise generated by the camera module may bedeteriorated, thereby deteriorating the RF sensitivity of the opticaldevice on which the camera module is mounted.

If d5/d1 and/or d6/d2 is less than 1, the horizontal length of theadhesive 83 may become greater than the horizontal length of the cavity31, and the adhesive 83 may thus be disposed on the lower surface of thesecond region 802 outside the cavity 31, with the result that theresistance value between the reinforcing member 85 and the ground of theboard 800 may increase to 1 ohm or higher.

If d5/d1 or d6/d2 is greater than 2, because the surface area of theadhesive 83 decreases, the adhesive force between the reinforcing member85 and the board 800 may decrease, and thus the reinforcing member 85may easily escape the board 800.

Referring to FIG. 2D, the distance d7 between the first outer surface 5a (or the first outer surface 6 b) of the second region 802 of the board800 and the first side surface (or second side surface) of thereinforcing member 85 may be less than the distance d1 (d7<d1). Thedistance d8 between the third outer surface 5 c of the second region 802of the board 800 and the third side surface of the reinforcing member 85may be less than the distance d2 (d8<d2).

For example, each of the distances d1 to d8 may be the shortest distancebetween two planes parallel to the two surfaces in question.

The thickness (for example, the thickness of the first portion 71 a) T1of the first noise-blocking portion 71 may be less than the depth H ofthe cavity 31 in the board 800 (T1<H). Here, the thickness of the firstnoise-blocking portion 71 may be the length of the first noise-blockingportion 71 in the optical-axis direction.

For example, the thickness (the thickness of the first portion 71 a) T1of the first noise-blocking portion 71 may range from 12 m to 18 m.

The side surfaces of the first portion 71 a of the noise-blockingportion 71 may be positioned farther than the inner surfaces 31 a to 31d of the cavity 31 from the outer surfaces 5 a to 5 c of the secondregion 802 of the board 800.

The side surfaces of the adhesive 83 may be positioned farther than theinner surfaces 31 a to 31 d of the cavity 31 from the outer surfaces 5 ato 5 c of the second region 802 of the board 800.

Furthermore, the outer surfaces of the reinforcing member 85 may bepositioned closer than the side surfaces 31 a to 31 d of the cavity 31in the board 300 to the outer surfaces 5 a to 5 c of the second region802 of the board 800.

The surface area of the first portion 71 a of the noise-blocking portion71, which overlaps the second region 802 of the board 800 in theoptical-axis direction of the lens moving unit 100 may be smaller thanthat of the bottom surface of the cavity 31.

Furthermore, the surface are of the adhesive 83 that overlaps the secondregion 802 of the board 800 in the optical-axis direction may be smallerthan that of the bottom surface of the cavity 31 in the board 800.

The adhesive 83 may include adhesive resin and conductive particles.

FIG. 6 illustrates an embodiment of the adhesive 83.

Referring to FIG. 6, the adhesive 83 may include resin 83 b andconductive particles 83 a. The conductive particles 83 a of the adhesive83 are not depicted in FIG. 3.

Although the resin 83 b may be a nonconductive resin layer, thedisclosure is not limited thereto. In another embodiment, the resin 83 bmay be a conductive resin layer. For example, the resin 83 b may beFGBF-700.

For example, the diameter of the conductive particle 83 a may be greaterthan the thickness of the noise-blocking layer 71. Alternatively, thediameter of the conductive particle 83 a may be greater than or equal tothe depth H of the cavity 31.

For example, the thickness T2 of the adhesive 83 may be greater than thethickness T1 of the first noise-blocking portion 71 (T2>T1). Forexample, the thickness T2 of the adhesive 83 may range from 24 m to 26m. For example, the thickness T2 of the adhesive 83 may be the maximumthickness of the adhesive, in consideration of the diameter of theconductive particles 83 a.

The conductive particles 83 a of the adhesive 83 may come into contactwith the exposed pattern layer 82-6 of the second region 802 of theboard 800 through the first noise-blocking portion 71 (for example, thefirst portion 71 a).

The reinforcing member 850 may be conductively connected to the patternlayer 82-6 of the second region 802 of the board 800.

The thickness T3 of the reinforcing member 85 may be less than theoverall thickness of the board 800 but greater than the thickness of theflexible substrate 800-1 and the thickness of the adhesive 83. Forexample, the thickness of the reinforcing member 85 may range from 90 mto 120 m.

The thickness T3 of the reinforcing member 85 may be greater than thethickness T1 of the first noise-blocking portion 71 and the thickness T2of the adhesive 83 (T3>T1, T2).

Referring to FIGS. 3 and 4, the upper surface of the reinforcing member85 may be in contact with the second surface (or the lower surface) 11 bof the second region 802 of the board 800. For example, the uppersurface of the periphery of the reinforcing member 85 may be in contactwith the second surface (or the lower surface) 11 b of the second region802 of the board 800.

In another embodiment, the upper surface of the periphery of thereinforcing member 85 may be spaced apart from the second surface 11 bof the second region 802 of the board 800.

FIG. 7 illustrates the case in which the size of an adhesive 30 and thesize of an EMI film 20 are larger than the size of a groove 10-1 in aboard 10.

In this case, because the size of the EMI film 20 and the size of theadhesive 30 are larger than the size of the groove 10-1 in the board 10through which a ground pattern layer 10 a of the board 10 is exposed,when the EMI film 20 is attached to the lower surface of the board 10and a reinforcing member 40 having the adhesive 30 applied thereto isattached to the EMI film 20, a void or a lifting phenomenon may occurbetween the ground pattern layer 10 a of the board 10, which is exposedthrough the groove 10-1, and the reinforcing member 40, as illustratedin FIG. 7.

Furthermore, because the void is created between the adhesive 20 and theground pattern layer 10 a, the conductive particles of the adhesive 30may have difficulty coming into contact with the ground pattern layer 10a through the EMI film 20 even when pressed using a hot press, wherebythe resistance (for example, electrical resistance) between the groundof the board 10 and the reinforcing member 40 may increase. For example,in the case of FIG. 7, the resistance between the ground of the board 10and the reinforcing member 40 may be 1 ohm or higher.

In contrast, the embodiment of the present invention is able to block orreduce EMI noise generated from the camera module 200 by positioning thefirst noise-blocking portion 71 between the pattern layer 82-6 that isexposed through the cavity 31 in the second region 802 of the board 800and the reinforcing member 85. In addition, since the firstnoise-blocking portion 71 and the adhesive 83 are disposed in the cavity31 such that the first noise-blocking portion 71 and the adhesive 83 arein close contact with the pattern layer 82-6, which is exposed throughthe cavity 31, it is possible to reduce the electrical resistancebetween the pattern layer 82-6 of the board 800, which is used as theground, and the reinforcing member 85, and it is thus possible to usethe reinforcing member 85 as the ground of the board 800. Specifically,according to the embodiment, the electrical resistance between thepattern layer 82-6 of the board 800 and the reinforcing member 85 may belower than 1 ohm.

A camera module according to another embodiment may further include anoise-blocking portion, which is disposed at at least one of the firstsurface 11 a and the second surface 11 b of the first region 801 and thefirst surface 11 a of the second region 802 of the board 800.

FIG. 8 is a perspective view of a camera module according to anotherembodiment of the present invention.

Referring to FIG. 8, the camera module 200 may include a lens or a lensbarrel 400, the lens moving unit 100, an adhesive member 612, a filter610, a holder 600, a board 800, an image sensor 810, a motion sensor820, a controller 830, a connector 840, a noise-blocking unit 70, anadhesive (not shown) and a reinforcing member 85. The same numerals asthose in FIG. 1 indicate the same components, and descriptions of thesame components will be made briefly or omitted.

The description regarding the noise-blocking unit 70, which has beenmade with reference to FIG. 1, may also be applied to the noise-blockingunit 70 shown in FIG. 8, the description regarding the adhesive 83, madewith reference to FIG. 1, may also be applied to the noise-blocking unit(not shown) in FIG. 8, and the description regarding the reinforcingmember, made with reference to FIG. 1, may also be applied to thereinforcing member 85 shown in FIG. 8.

The lens or lens barrel 400 may be mounted on the lens moving unit 100.

The lens moving unit 100 may be referred to as a “sensing unit”, an“imaging unit”, a “VCM (Voice Coil Motor)” or a “lens moving apparatus”.

For example, the lens moving unit 100 may be an AF lens moving unit oran OIS lens moving unit. Here, the AF lens moving unit may be a unitcapable of performing only an autofocus function, and the OIS lensmoving unit may be a unit capable of performing both an autofocusfunction and an OIS (Optical Image Stabilizer) function.

For example, the lens moving unit 100 may be an AF lens moving device.The AF lens moving device may include a housing, a bobbin disposed inthe housing, a coil disposed at the bobbin, a magnet disposed at thehousing, at least one elastic member coupled both to the bobbin and tothe housing, and a base disposed under the bobbin (and/or the housing).The elastic member may include, for example, the above-described upperand lower elastic members.

The coil may be provided with a drive signal (for example, drivingcurrent), and the bobbin may be moved in the optical-axis directionusing the electromagnetic force resulting from the interaction betweenthe coil and the magnet. In another embodiment, the coil may be disposedat the housing, and the magnet may be disposed at the bobbin.

For AF feedback operation, the AF lens moving device may further includea sensing magnet disposed at the bobbin, an AF position sensor (forexample, a hall sensor) disposed at the housing, and a circuit board, atwhich the AF position sensor is disposed and which is disposed ormounted on the housing and/or the base. In another embodiment, the AFposition sensor may be disposed at the bobbin, and the sensing magnetmay be disposed at the housing.

The circuit board may be conductively connected to the coil and the AFposition sensor. A drive signal may be provided to the coil and the AFposition sensor via the circuit board, and the output of the AF positionsensor may be transmitted to the circuit board.

The camera module according to another embodiment may include a housing,which is coupled to the lens or lens barrel 400 so as to hold the lensor lens barrel 400, in place of the lens moving unit 100, and thehousing may be coupled or attached to the upper surface of the holder600. The housing, which is attached or fixed to the holder 600, may beimmovable, and may be maintained in the position in the state of beingattached to the holder 600.

For example, the lens moving unit 100 may be an OIS lens moving unit.

The OIS lens moving unit may include a housing, a bobbin disposed in thehousing so as to mount a lens or lens barrel 400 thereon, a first coildisposed at the bobbin, a magnet disposed at the housing so as to facethe first coil, at least one upper elastic member coupled both to theupper portion of the bobbin and to the upper portion of the housing, atleast one lower elastic member coupled both to the lower portion of thebobbin and to the lower portion of the housing, a second coil disposedunder the bobbin (and/or the housing), a circuit board disposed underthe second coil, and a base disposed under the circuit board.

The OIS lens moving unit may further include a cover member, which iscoupled to the base so as to define a space for accommodating thecomponents of the lens moving unit therein in conjunction with the base.

The OIS lens moving unit may further include a support member, whichconductively connects the circuit board to the upper elastic member andsupports the housing with respect to the base. Each of the first coiland the second coil may be conductively connected to the circuit board250, and may receive a drive signal (drive current) from the circuitboard.

For example, the upper elastic member may include a plurality of uppersprings, and the support member may include support members connected tothe upper springs. The first coil may be conductively connected to thecircuit board via the upper springs and the support members. The circuitboard may include a plurality of terminals, and some of the plurality ofterminals may be conductively connected to the first coil and/or thesecond coil.

By virtue of the electromagnetic force resulting from the interactionbetween the first coil and the magnet, the bobbin and the lens or lensbarrel 400 coupled to the bobbin is movable in the optical-axisdirection such that the displacement of the bobbin in the optical-axisdirection is controlled, thereby realizing an AF operation.

Furthermore, by virtue of the electromagnetic force resulting from theinteraction between the second coil and the magnet, the housing ismovable in a direction perpendicular to the optical-axis direction,thereby realizing handshake correction or OIS operation.

For AF feedback operation, the OIS lens moving unit may further includea sensing magnet disposed at the bobbin, and an AF position sensor (forexample, a hall sensor) disposed at the housing. The OIS lens movingunit may further include a circuit board (not shown), which is disposedat the housing and/or the base and on which the AF position sensor isdisposed or mounted. In another embodiment, the AF position sensor maybe disposed at the bobbin, and the sensing magnet may be disposed at thehousing. The OIS lens moving unit may further include a balancing magnetdisposed at the bobbin so as to correspond to the sensing magnet.

The AF position sensor may output an output signal corresponding to theresult of detection of variation in the intensity of the magnetic fieldof the sensing magnet due to movement of the bobbin. The AF positionsensor may be conductively connected to the circuit board via the upperelastic member (or the lower elastic member) and/or the support member.The circuit board may provide a drive signal to the AF position sensor,and the output from the AF position sensor may be transmitted to thecircuit board. The controller 830 may sense or detect the displacementof the bobbin using the output from the AF position sensor.

The holder 600 may be disposed under the lens moving unit 100 (forexample, the base). The filter 610 may be mounted on the holder 600, andthe holder 600 may include a projection 500 on which the filter 610 isto be seated.

The adhesive member 612 may couple or attach the lens moving unit 100(for example, the base) to the holder 600. In addition to the attachmentfunction described above, the adhesive member 6120 may serve to preventcontaminants from entering the lens moving unit 100.

The adhesive member 612 may be thermohardening adhesive (for example,thermohardening epoxy) or ultraviolet-hardening adhesive (for example,ultraviolet-hardening epoxy).

The filter 610 may serve to prevent light within a specific frequencyband that passes through the lens barrel 400 from being introduced intothe image sensor 810. The filter 610 may be, for example, aninfrared-light-blocking filter, without being limited thereto. Here, thefilter 610 may be oriented parallel to the X-Y plane.

The region of the holder 600 in which the filter 610 is mounted may beprovided with a bore in order to allow the light that passes through thefilter 610 to be introduced into the image sensor 810.

The board 800 may be disposed under the holder 600, and the image sensor810 may be mounted on the board 600. The image sensor 810 may be theregion on which an image included in the light that passes through thefilter 610 and is introduced thereinto is formed.

The board 800 may include, for example, various circuits, devices, and acontroller in order to convert the image formed on the image sensor 810into electrical signals and to transmit the electrical signals toexternal components.

The board 800 may be embodied as a board on which the image sensor maybe mounted, on which a circuit pattern may be formed, and to whichvarious devices may be coupled. The holder 600 may alternatively bereferred to as a “sensor base”, and the board 800 may alternatively bereferred to as a “circuit board”.

In another embodiment, some region of the board 800 may be embodied asbeing included in the lens moving unit 100 or as not being included inthe lens moving unit 100.

The image sensor 810 may receive an image included in the lightintroduced through the lens moving unit 100, and may convert thereceived image into an electrical signal.

The filter 610 and the image sensor 810 may be disposed so as to bespaced apart from each other in the state of facing each other in theoptical-axis direction.

The motion sensor 820 may be mounted on the board 800, and may beconductively connected to the controller 830 through the circuit patternformed on the board 800.

The motion sensor 820 may output rotational angular speed caused bymotion of the camera module 200. The motion sensor 820 may be embodiedas a dual-axis or triple-axis gyro sensor or an angular speed sensor.

The controller 830 may be mounted on the board 800, and may beconductively connected to the lens moving unit 100. The controller 830may provide the lens moving unit 100 with a signal for driving the AFcoil, a signal for driving the OIS coil, a signal for driving the AFposition sensor and/or a signal for driving the OIS (Optical ImageStabilization) position sensor.

Furthermore, the controller 830 may receive the output from the AFposition sensor and/or the output from the OIS position sensor.Furthermore, the controller 830 may provide the AF coil with a signalfor AF feedback operation using the output from the AF position sensor,and may provide the OIS coil with a signal for OIS feedback operationusing the output from the OIS position sensor of the lens moving unit100.

The connector 840 may be conductively connected to the board 800, andmay have a port that is intended to be conductively connected to anexternal device.

The lens moving unit 100 according to the embodiment may be included inan optical instrument, which is designed to form the image of an objectin a space using reflection, refraction, absorption, interference,diffraction or the like, which are characteristics of light, to extendeyesight, to record an image obtained through a lens or to reproduce theimage, to perform optical measurement, or to propagate or transmit animage. For example, although the optical instrument according to theembodiment may be a mobile phone, cellular phone, smart phone, portablesmart instrument, digital camera, laptop computer, digital broadcastingterminal, PDA (Personal Digital Assistant), PMP (Portable MultimediaPlayer), navigation device, or the like, the disclosure is not limitedthereto. Furthermore, any device capable of taking images or photographsis possible.

FIG. 9 is a perspective view illustrating a portable terminal 200Aaccording to an embodiment. FIG. 10 is a view illustrating theconfiguration of the portable terminal illustrated in FIG. 9.

Referring to FIGS. 9 and 10, the portable terminal 200A (hereinafterreferred to as a “terminal”) may include a body 850, a wirelesscommunication unit 710, an audio/video (A/V) input unit 720, a sensingunit 740, an input/output unit 750, a memory unit 760, an interface unit770, a controller 780, and a power supply unit 790.

The body 850 illustrated in FIG. 9 has a bar shape, without beinglimited thereto, and may be any of various types, such as, for example,a slide type, a folder type, a swing type, or a swivel type, in whichtwo or more sub-bodies are coupled so as to be movable relative to eachother.

The body 850 may include a case (e.g. a casing, housing, or cover)defining the external appearance of the terminal. For example, the body850 may be divided into a front case 851 and a rear case 852. Variouselectronic components of the terminal may be accommodated in the spacedefined between the front case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the terminal 200A and awireless communication system or between the terminal 200A and a networkin which the terminal 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast-receiving module 711, amobile communication module 712, a wireless Internet module 713, anearfield communication module 714, and a location information module715.

The A/V input unit 720 serves to input audio signals or video signals,and may include, for example, a camera 721 and a microphone 722.

The camera 721 may include the camera module 200 according to theembodiment illustrated in FIG. 1 or 8. As described above, since thecamera module 200 is capable of improving EMI-noise-blockingperformance, it is possible to improve the RF (Radio Frequency)sensitivity of the portable terminal 200A.

The sensing unit 740 may sense the current state of the terminal 200A,such as, for example, the opening or closing of the terminal 200A, thelocation of the terminal 200A, the presence of a user's touch, theorientation of the terminal 200A, or the acceleration/deceleration ofthe terminal 200A, and may generate a sensing signal to control theoperation of the terminal 200A. When the terminal 200A is, for example,a slide-type cellular phone, the sensing unit 740 may sense whether theslide-type cellular phone is opened or closed. Furthermore, the sensingunit 740 may sense the supply of power from the power supply unit 790,coupling of the interface unit 770 to an external device, and the like.

The input/output unit 750 serves to generate, for example, visual,audible, or tactile input or output. The input/output unit 750 maygenerate input data to control the operation of the terminal 200A, andmay display information processed in the terminal 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touchscreen panel 753. Thekeypad unit 730 may generate input data in response to input on akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich varies depending on the electrical signals applied thereto. Forexample, the display module 751 may include at least one among a liquidcrystal display, a thin-film transistor liquid crystal display, anorganic light-emitting diode, a flexible display and a 3D display.

The sound output module 752 may output audio data received from thewireless communication unit 710 in, for example, a call-signal receptionmode, a call mode, a recording mode, a voice recognition mode, or abroadcast reception mode, or may output audio data stored in the memoryunit 760.

The touchscreen panel 753 may convert variation in capacitance, causedby a user's touch on a specific region of a touchscreen, into electricalinput signals.

The memory unit 760 may temporarily store programs for the processingand control of the controller 780, and input/output data (for example,telephone numbers, messages, audio data, stationary images, movingimages and the like). For example, the memory unit 760 may store imagescaptured by the camera 721, for example, pictures or moving images.

The interface unit 770 serves as a path through which the lens movingunit is connected to an external device connected to the terminal 200A.The interface unit 770 may receive power or data from the externalcomponent, and may transmit the same to respective constituent elementsinside the terminal 200A, or may transmit data inside the terminal 200Ato the external component. For example, the interface unit 770 mayinclude a wired/wireless headset port, an external charger port, awired/wireless data port, a memory card port, a port for connection to adevice equipped with an identification module, an audio input/output(I/O) port, a video input/output (I/O) port, an earphone port and thelike.

The controller 780 may control the general operation of the terminal200A. For example, the controller 780 may perform control and processingrelated to, for example, voice calls, data communication, and videocalls.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be embodied in the controller780, or may be embodied separately from the controller 780.

The controller 780 may perform a pattern recognition process capable ofrecognizing writing input or drawing input carried out on a touch screenas a character and an image, respectively.

The power supply unit 790 may supply power required to operate therespective constituent elements upon receiving external power orinternal power under the control of the controller 780.

The features, configurations, effects and the like described above inthe embodiments are included in at least one embodiment, but theinvention is not limited only to the embodiments. In addition, thefeatures, configurations, effects and the like exemplified in therespective embodiments may be combined with other embodiments ormodified by those skilled in the art. Accordingly, content related tothese combinations and modifications should be construed as fallingwithin the scope of the disclosure.

INDUSTRIAL APPLICABILITY

The embodiments are applicable to a camera module and an optical deviceincluding the same, which are capable of improving performance ofblocking EMI noise and of reducing the electrical resistance between thereinforcing member and a ground of a board.

1. A camera module comprising: a lens moving unit including a lens; aconnecting board connected to the lens moving unit; and a connector unitconnected to the connecting board, wherein the connector unit includes:a board including a cavity and a ground layer formed in an upper surfacethereof; a noise-blocking unit disposed in the cavity of the board so asto be in contact with the ground layer; and a reinforcing member, whichis disposed on the noise-blocking unit and is disposed over the cavityof the board and on an upper surface of the board, and wherein a lengthof one side of the noise-blocking unit is less than a length of one sideof the cavity of the board when viewed in a plan view.
 2. The cameramodule according to claim 1, wherein the noise-blocking unit includes afirst portion disposed in the cavity of the board and a second portiondisposed on the connecting board, an end of the first portion beingdisposed in the cavity of the board.
 3. The camera module according toclaim 1, wherein a length of a short side of the noise-blocking unit isless than a length of a long side of the cavity of the board.
 4. Thecamera module according to claim 1, wherein a region of the ground layerdefines a bottom surface of the cavity of the board.
 5. The cameramodule according to claim 1, wherein a length of one long side of thecavity of the board is greater than a length of another long side of thecavity o f the board.
 6. The camera module according to claim 1,comprising an adhesive disposed between the reinforcing member and thenoise-blocking unit.
 7. The camera module according to claim 1, whereinthe cavity of the board includes a first inner surface, and thenoise-blocking unit includes a first surface that faces the first innersurface of the cavity of the board, the first surface of thenoise-blocking unit being spaced apart from the first inner surface ofthe cavity of the board.
 8. The camera module according to claim 7,wherein the cavity of the board includes a second inner surface thatfaces the first inner surface and a third inner surface connecting thefirst inner surface to the second inner surface, and the noise-blockingunit includes a second surface that faces the second inner surface ofthe cavity of the board and a third surface that faces the third innersurface of the cavity of the board, the second surface of thenoise-blocking unit being spaced apart from the second inner surface ofthe cavity of the board, and the third surface of the noise-blockingunit being spaced apart from the third inner surface of the cavity ofthe board.
 9. The camera module according to claim 6, wherein a portionof the adhesive is disposed in the cavity of the board.
 10. The cameramodule according to claim 6, wherein the adhesive includes a conductiveparticle, which is in contact with the ground layer through thenoise-blocking unit.
 11. The camera module according to claim 1, whereina resistance value between the reinforcing member and the ground layeris lower than 1 ohm.
 12. The camera module according to claim 11,wherein the reinforcing member is made of conductive metal.
 13. Thecamera module according to claim 10, wherein a diameter of theconductive particle is greater than a thickness of the noise-blockinglayer.
 14. The camera module according to claim 2, wherein thenoise-blocking unit comprises a third portion connecting the firstportion and the second portion.
 15. The camera module according to claim1, wherein the board comprises: a first board on which the lens movingunit is disposed; and a second board in which the cavity and the groundlayer are formed, wherein the connecting board connects the first boardand the second board.
 16. A camera module comprising: a lens moving unitincluding a lens: a connecting board connected to the lens moving unit;and a connector unit connected to the connecting board, wherein theconnector unit comprises: a board including a cavity and a ground layerformed in an upper surface thereof; a noise-blocking unit disposed inthe cavity of the board so as to be in contact with the ground layer;and a reinforcing member disposed on the noise-blocking unit, whereinthe noise-blocking unit comprises a first portion disposed in the cavityof the board and a second portion disposed on the connecting board, andwherein an end of the first portion is disposed in the cavity of theboard.
 17. The camera module according to claim 16, wherein the end ofthe first portion is spaced apart from a side wall of the cavity. 18.The camera module according to claim 16, comprising an adhesive disposedbetween the reinforcing member and the first portion of thenoise-blocking unit.
 19. The camera module according to claim 16,wherein a vertical length of the first portion is less than a verticallength of the cavity.
 20. An optical instrument comprising the cameramodule according to claim 1.